Purpose of a Flex PCB Fabrication
The purpose of an flex pcb fabrication is to convert your PCB design into a functioning, high-quality printed circuit board. There are many important factors to consider in a flex pcb fabrication including raw materials, layers, etching process, copper plating, coverlay application, and more. It is vital to understand all of these factors in order to design a successful flex pcb that meets your product’s functionality and durability requirements.
Using the right PCB raw material is one of the most important aspects of a flex pcb fabrication. The most common PCB raw materials used in flex PCBs include FR4, glass fiber, and thin flexible epoxy and/or glass-fiber cores. Depending on the application, different thicknesses of each raw material may be used to create a thicker or thinner circuit board.
A PCB’s thickness is a key factor in its overall performance. A thicker board can be more rigid and better able to withstand bending and stress, while a thinner board can offer greater flexibility and EMI/RFI shielding. A flex pcb fabrication can also be made with different finishes, such as tin and soft gold, which can enhance its appearance and provide additional protection from corrosion and wear.
The Purpose of a Flex PCB Fabrication
For an effective flex pcb fabrication, it is essential to follow PCB design standards and guidelines. For example, traces should be spaced far enough apart to prevent interference between them. This can reduce noise and improve signal timing. In addition, conductors should be routed perpendicular to the bend radius of the circuit to minimize stress on the copper traces and to eliminate I-beaming in curved areas. Using annular rings (pad fillets) instead of standard round-nose vias can also decrease the likelihood of stress points and failure.
Another important aspect of a flex pcb is the use of stiffeners. Stiffeners are localized rigid materials that can be added to the flex circuit to improve its mechanical properties. Typically, these are made of FR4 and metal (usually aluminum or stainless steel). They are attached to the flex circuit using acrylic thermally cured adhesives or epoxy. Stiffeners can be helpful in areas where the flex circuit is required to withstand a large amount of strain, such as edges and mounting holes.
A flex pcb fabrication can also be enhanced by the addition of protective beads. These are placed on the flex-to-rigid joins or interfaces. They are designed to reduce EMI/RFI interference and increase a flex circuit’s durability in harsh environments.
Other useful options include adding copper pads or plated through-holes. To ensure the quality of these components, the flex circuit should be tested and verified. For example, if there are any short circuits or cut traces, the PCBWay should perform an electrical test to make sure the problem is resolved.
In addition, if the flex circuit needs to be soldered to another part of the device, it is crucial to add adhesive tape to selected areas. This will allow the flex circuit to stick securely to a surface and help prevent it from falling off during assembly.
